提升競爭力 矽菱引進多項半導體設備

зҹҪиҸұдјҒжҘӯиҝ‘жңҹж–°еј•йҖІеӨҡй …еҚҠе°Һй«”иЁӯеӮҷпјҢеҢ…жӢ¬пјҡйҹ“еңӢSSPе…¬еҸёзҡ„WLCSPеҸҠе…ҲйҖІе°ҒиЈқжӨҚзҗғж©ҹгҖҒVision Semicomе…¬еҸёзҡ„йӣ»жјҝжё…жҙ—ж©ҹзӯүгҖҒShinsungе…¬еҸёзҡ„AGVв•ұRGVв•ұOHSв•ұOHTзӯүе·Ҙе» иҮӘеӢ•еҢ–зі»зөұгҖҒSEMICSе…¬еҸё 12еҜё Prober systemпјҢеҠ дёҠеҺ»е№ҙ第4еӯЈеҠ е…Ҙзҡ„IntekplusеӨ–и§ҖжӘўжё¬иЁӯеӮҷпјҢз”ўе“ҒйҷЈе®№зӣӣеӨ§гҖӮIntekplusжё¬и©Ұж©ҹIPIS360йҒ©з”Ёж–јQFNгҖҒQFPгҖҒTSOPеҸҠBGAзӯүеҗ„ејҸе°ҒиЈқеһӢејҸе…ғ件зҡ„PVIеӨ–и§ҖжӘўжё¬пјҢе…ғ件еңЁTrayзӣӨдёҠзӣҙжҺҘжӘўжё¬пјҢдёҚйңҖP&PиЁӯеӮҷпјҢжёӣе°‘еҸ–зҪ®жҷӮй–“еҸҠдәәзӮәиӘӨеӨұпјӣз”ұж–јIn-Tray зҡ„жӘўжё¬еҺҹзҗҶпјҢUPHиЎЁзҸҫжҳҺйЎҜеӢқеҮәгҖӮIntekplusиҝ‘жңҹд№ҹжҺЁеҮәIPIS500пјҢйҮқе°ҚFCBGAеҸҠWLCSжҮүз”ЁпјҢй…ҚеӮҷ25Mй«ҳеғҸзҙ CCDгҖҒе…·еӮҷbottomв•ұtopдёҠдёӢз«Ҝ3Dзҡ„жӘўжё¬иғҪеҠӣпјҢжҸҗдҫӣе®ўжҲ¶е°Қж–јеҫ®е°Ҹзјәйҷ·зҡ„жӘўжё¬гҖӮIntekplusе°Ү於第4еӯЈжҺЁеҮәiPIS380TRй«ҳйҖҹжӘўжё¬еҸҠе°Ғеё¶зҡ„ж©ҹеҷЁпјҢICеҚҠе°Һй«”з”ўжҘӯз•ҢеқҮжӢӯзӣ®д»Ҙеҫ…гҖӮйҹ“еңӢSEMICSзҡ„Probeе·Іиў«еңӢйҡӣдёҖзҙҡеӨ§е» иӘҚеҸҜпјҢеҸ°зҒЈе®ўжҲ¶дё»иҰҒзӮәж¬ЈйҠ“гҖҒеҸ°ж–°з§‘гҖҒиүҫе…ӢзҲҫгҖҒзҹҪж јгҖҒзҹҪе“Ғзӯүжҷ¶ең“жё¬и©ҰеӨ§е» пјҢзӣ®еүҚSEMICSжҺЁеҮәе…Ёзҗғ第дёҖеҸ°зөҗеҗҲwafer probingиҲҮ laser cleaningзҡ„иЁӯеӮҷпјҢжӯЈз”ұжӯҗзҫҺеңӢйҡӣIDMеӨ§е» й©—иӯүдёӯпјҢжңӘдҫҶеңӢе…§жҷ¶ең“д»Је·ҘеӨ§е» д№ҹжңүдёҖе®ҡйңҖжұӮпјҢзҹҪиҸұе°ҚжӯӨж–°з”ўе“Ғж·ұе…·дҝЎеҝғгҖӮеҸҰеӨ–пјҢVision Semicon Plasmaжё…жҙ—ж©ҹд»Ҡе№ҙ7жңҲиҪүз”ұзҹҪиҸұд»ЈзҗҶпјҢи©ІиЁӯеӮҷжҮүз”Ёж–јй«ҳз«Ҝе°ҒиЈқз”ўе“Ғијүжқҝжё…жҙ—пјҢд№ҹж”ҜжҸҙWLCSP bumping з«Ҝwaferжё…жҙ—пјҢзҚІеҫ—й«ҳйҖҡе…¬еҸёй«ҳеәҰиӮҜе®ҡгҖӮSSPжӨҚзҗғж©ҹйҺ–е®ҡж¬Ўдё–д»Јзҡ„BGAжҲ–FCBGAпјҢд»Ҙu-pitchзҡ„жӨҚзҗғзӮәдё»иҰҒиЁҙжұӮе°ҚиұЎпјҢIntelе·ІжҺЎз”ЁжӯӨиЁӯеӮҷйҖІиЎҢж¬Ўдё–д»Је°ҒиЈқпјҢй җдј°е°Ғжё¬йӣҷйӣ„зҡ„йңҖжұӮд№ҹеҫҲеҸҜи§ҖгҖӮи‘ЈдәӢй•·иҢғж–Үз©ҺиЎЁзӨәпјҢеңЁжҲҗжң¬еЈ“еҠӣдёӢпјҢзӮәе®ўжҲ¶жүҫеҲ°жӣҙ具競зҲӯжҖ§зҡ„з”ўе“ҒпјҢжҘөе…·жҢ‘жҲ°жҖ§гҖӮе°ҒиЈқе» з©ҚжҘөж“ҙе……Flip Chipз”ўз·ҡпјҢд»Ҙеӣ жҮүжүӢжҢҒиЎҢеӢ•з”ўе“Ғзҷјеұ•иҝ…йҖҹзӮәдҫӢпјҢзҹҪиҸұй–ӢзҷјеҸҜи§ЈжұәESDпјҲйқңйӣ»ж¶Ҳж•Јпјүзҡ„Flip Chip Pickup ToolпјҢеҗ„еӨ§е» йҷёзәҢе°Һе…Ҙз”ҹз”ўпјҢж·ұеҸ—еҘҪи©•гҖӮHAESUNG DSгҖҒ MKEгҖҒR-SEMICONгҖҒINNOXгҖҒACCRETECH DIAMOND BLADEгҖҒESA BURN-IN BOARDеҸҠTaisElec Pogo PinпјҢеқҮзӮәзҹҪиҸұеңЁеҚҠе°Һй«”з”ўжҘӯзҡ„й•·жңҹеҗҲдҪңеӨҘдјҙпјҢз”ўе“ҒеҸ—еҲ°е°Ғжё¬еӨ§е» еҘҪи©•пјҢйҹ“еңӢKCCпјҲйҮ‘еүӣй«ҳйә—еҢ–еӯёпјүзҡ„EMCгҖҒDie Attach PasteпјҲB-stageпјүгҖҒUnderFill for FlipChipгҖҒSemiconductor FilmгҖҒDCBпјҲDirect Copper BondingпјүSubstrateгҖҒSolder Resistе’ҢSiliconeпјҢжҮүз”Ёж–јеҚҠе°Һй«”гҖҒLEDеҸҠи»Ҡз”ЁеёӮе ҙгҖӮеҸҰеӨ–еңЁе°ҒиЈқжЁЎеЈ“зҡ„жё…жЁЎеҸҠжҪӨжЁЎж–№йқўпјҢзҹҪиҸұд№ҹжҸҗдҫӣз„Ўз…ҷйң§пјҢз„ЎиҮӯе‘іеҸҠз„Ўи…җиқ•зҡ„Rubber Cleaner & Rubber Waxжқҗж–ҷд»ҘеҸҠPaper Lв•ұFе’ҢWax CompoundпјҢзҹҪиҸұеӣ иҖҢеҸ—еҲ°жӣҙеӨҡжңүж„ҸйҖІи»ҚеҸ°зҒЈеёӮе ҙзҡ„еңӢеӨ–иЁӯеӮҷжқҗж–ҷеӨ§е» йҮҚиҰ–гҖӮиҢғж–Үз©ҺиЎЁзӨәпјҢд»ЈзҗҶзҡ„з”ўе“ҒеқҮиў«еңӢйҡӣеӨ§е» иӘҚиӯүжҺЎз”ЁпјҢз”ұж–јеңӢе…§жҘӯиҖ…д»Ҙд»Је·ҘзӮәдё»пјҢиЁӮе–®еӨҡжЁЈжҖ§пјҢиЁӯеӮҷеҝ…йңҖйҡЁи‘—з”ҹз”ўиӘҝж•ҙпјҢи®ҠеӢ•жҖ§й«ҳпјҢйҖҷжҳҜжҺЁеұ•еҲқжңҹжңҖеёёзў°еҲ°зҡ„е•ҸйЎҢгҖӮзҹҪиҸұж“ҙеӨ§з¶ӯдҝ®жңҚеӢҷеңҳйҡҠз·ЁеҲ¶пјҢдёҰиҲҮеҺҹе» е……еҲҶжәқйҖҡпјҢеҚіжҷӮеҸҚжҮүе®ўжҲ¶зҡ„е•ҸйЎҢпјҢеҝ«йҖҹеҫ—еҲ°и§ЈжұәгҖӮзҹҪиҸұйӣ»и©ұпјҲ03пјү560-1066пјҢеҚҠе°Һй«”еұ•ж”ӨдҪҚеңЁM932иҷҹгҖӮ