2012高效率LED封裝整合研討會　Cree、鉅贊、璦司柏、聚創與TOWA

з¶ иғҪз”ўжҘӯзҸҫзӮәе…ЁзҗғжңҖй—ңжіЁзҡ„иӯ°йЎҢпјҢиҖҢLEDз”ўжҘӯе·ІжҲҗзӮәжңҖйҮҚиҰҒзҡ„жҢҮжЁҷжҖ§з”ўе“Ғд№ӢдёҖпјҢе…Ёзҗғеҗ„еңӢйғҪе°ҚLEDз…§жҳҺзҘӯеҮәиЈңеҠ©ж”ҝзӯ–пјҢжңҹжңӣеҠ йҖҹзөӮз«ҜеёӮе ҙе°ҚLEDзҡ„жҺҘеҸ—еәҰпјҢйҡЁи‘—LEDз”ўе“ҒйҒӢз”Ёй ҳеҹҹзҡ„ж“ҙеўһпјҢ еҰӮдҪ•жҸҗеҚҮеҗ„й …иЁӯеӮҷиҲҮжқҗж–ҷзҡ„жҠҖиЎ“пјҢе·ІжҳҜLEDз”ўжҘӯ當дёӯжңҖйҮҚиҰҒзҡ„дёҖз’°пјҢеҗҢжҷӮеңЁLEDзҡ„еҝ«йҖҹйҖІеҢ–йҒҺзЁӢдёӯпјҢеҰӮдҪ•йҒҙйҒёеҮәжңҖйҒ©з•¶зҡ„жқҗж–ҷд»ҘеҸҠиЁӯеӮҷпјҢд№ҹжҳҜзӣ®еүҚLEDе°ҒиЈқжүҖйқўиҮЁжңҖеӨ§зҡ„йӣЈйЎҢгҖӮи—үз”ұ2011е№ҙ12жңҲ22ж—Ҙзҡ„гҖҢ2012й«ҳж•ҲзҺҮLEDе°ҒиЈқж•ҙеҗҲз ”иЁҺжңғгҖҚпјҢж•ҙеҗҲзЈҠжҷ¶гҖҒж•ЈзҶұгҖҒиЁӯеӮҷе» е•ҶпјҢи®“жүҖжңүLEDзӣёй—ңз”ўжҘӯеҫ—д»ҘзҚІеҫ—жңҖдҪізҡ„жқҗж–ҷеҸҠиЁӯеӮҷиіҮиЁҠпјҢеҫһжңҖдёҠжёёжҷ¶зүҮзҡ„йҒёж“ҮиҮійҷ¶з“·еҹәжқҝзҡ„йҒӢз”ЁпјҢеҠ д»Ҙиһўе…үзІүеЎ—дҪҲеҸҠLens Moldingзҡ„иЁӯеӮҷпјҢи®“LEDдҫӣжҮүйҸҲдёӯеӣӣеӨ§з’°зҜҖеҫ—д»Ҙе…ЁйқўжҖ§зҡ„еұ•зҸҫгҖӮгҖҢ2012й«ҳж•ҲзҺҮLEDе°ҒиЈқж•ҙеҗҲз ”иЁҺжңғгҖҚе°ҮзӮәжӮЁйӮҖи«ӢеҲ°жҷ¶зүҮе» е•ҶCreeзҡ„д»ЈзҗҶе•ҶпјҢйү…иҙҠеҜҰжҘӯзёҪ經зҗҶжқҺи©©еҮҢжј”иӘӘгҖҢIntroduction of Flux Eutectic Die AttachгҖҚиӯ°йЎҢпјӣйҷ¶з“·ж•ЈзҶұеҹәжқҝе» е•Ҷз’ҰеҸёжҹҸйӣ»еӯҗз ”зҷјйғЁеүҜзҗҶдҪҷжІіжҪ”пјҢи§ЈиӘӘгҖҢHigh resolution DPC ceramic substrate for flip chip diesгҖҚпјӣиҒҡеүөй–ӢзҷјеүҜзёҪй«ҳзү§жҒҶпјҢжңғеңЁйҖҷж¬Ўи«–еЈҮзҷјиЎЁгҖҢй«ҳеҠҹзҺҮLEDиһўе…үзІүеЎ—дҪҲжҠҖиЎ“гҖҚиӯ°йЎҢпјӣжңҖеҫҢз”ұTOWAж ӘејҸжңғзӨҫзҡ„жҝұз”°зӣҙжЁ№(Hamada Naoki)и«ҮгҖҢLiquid Resin in LED Molding Technology гҖҚгҖӮи«–еЈҮе°ҮйҮқе°Қ2012 LEDеҗ„й ҳеҹҹзҡ„еёӮе ҙжҸҗеүҚжҺЁеҮәж–°дёҖд»Ји§Јжұәж–№жЎҲпјҢCreeгҖҒйү…иҙҠгҖҒз’ҰеҸёжҹҸгҖҒиҒҡеүөиҲҮTOWAж ӘејҸжңғзӨҫпјҢеёҢжңӣи—үз”ұйҖҷж¬Ўи«–еЈҮе°ҮLEDдҫӣжҮүйҸҲдёҠе®№жҳ“зҷјз”ҹзҡ„е•ҸйЎҢпјҢе„ҳйҮҸеңЁйҖҷдёҖж¬Ўзҡ„жҙ»еӢ•дёӯпјҢеҲҶдә«зөҰзҸҫе ҙзҡ„иҒҪзңҫпјҢд№ҹйӮҖи«ӢLEDзӣёй—ңй ҳеҹҹзҡ„е» е•ҶеҸғеҠ гҖҢ2012й«ҳж•ҲзҺҮLEDе°ҒиЈқж•ҙеҗҲз ”иЁҺжңғгҖҚгҖӮи©ізҙ°жҙ»еӢ•д»Ӣзҙ№иҲҮе ұеҗҚж–№ејҸпјҢи«ӢдёҠhttp://www.digitimes.com.tw/seminar/ICP_20111222.htmз¶Із«ҷжҹҘи©ўпјҢжҲ–зӣҙжҺҘж’ӯжү“02-87128866еҲҶж©ҹ320й„ӯе°Ҹе§җгҖӮ